
Nexperia’s TrEOS technology optimizes the three pillars of ESD protection to deliver devices with the ideal combination of low capacitance, low clamping voltage and high
Measuring just 2 mm x 2 mm (14 pin), 2 mm x 2.4 mm (16 pin), 2 mm x 3.2 mm (20 pin) and 2 mm x 4 mm (24 pin), the 0.4 mm pitch DHXQFN packages are only 0.45 mm high.
These products use Nexperia’s proven TrEOS technology, which combines low clamping with low capacitance and high robustness.
This development results in the increasing need for voltage translators to connect the SoC to other standard process devices and I/O ports like legacy Class B and Class C
Next generation wearable and hearable devices are incorporating new levels of artificial intelligence (AI) and machine learning (ML), creating several challenges for prod
With RDS(on) up to 25% better than competing devices, they minimize energy losses and increase efficiency in load switching and battery management.
Additionally, this portfolio also aims to address the upcoming high-speed video-links as well as the OPEN Alliance MGbit ethernet applications.
Nexperia offers engineers access to one of the most extensive CFP packaged diodes portfolios on the market from one supplier.
Nexperia will demonstrate how its ongoing commitment to investment in R&D and capacity is supporting these megatrends with its expanding portfolio
The expansion of Nexperia’s expertise comes through the acquisition of Netherlands-based Nowi, founded in 2016.
Since the launch of ASFETs, success has been seen with products optimized for battery isolation, DC motor control, Power-over-Ethernet, automotive airbag applications and
Standard products include the PNU65010ER (CFP3) and PNU65010EP (CFP5) while AEC-Q101 qualified products include the PNU65010ER-Q (CFP3) and PNU65010EP-Q (CFP5).
Nexperia developed the TrEOS portfolio specifically to offer our customers a range of high-performance ESD protection solutions for applications such as USB3.2, USB4™, Th
In contrast to the battery voltage found in cars and smaller vehicles, 24 V board nets are typically used in trucks and commercial vehicles.
Nexperia developed the X2SON packages - part of its MicroPak package range - to provide the smallest footprint for logic functions while ensuring pad pitch remains 0.4mm
- IC TRNSLTR BIDIRECTIONAL 60HXQFN
- ZENER DIODE, 3.3V, 4.99%, 0.41W
- TRANS PNP 50V 200MA TO236AB
- TRANS NPN 50V 2A SOT89
- IC BUF NON-INVERT 3.6V 5TSSOP
- DIODE GEN PURP 100V 250MA SOD323
- IC FF D-TYPE SNGL 8BIT 20TSSOP
- IC FF D-TYPE DUAL 10BIT 56TSSOP
- DIODE SCHOTTKY 40V 120MA SOD523
- DIODE ZENER 16V 400MW ALF2
- MOSFET N-CH 110V 18A TO220AB
- TVS DIODE 14.5VWM 25VC TO236AB
- TRANS PREBIAS NPN 50V TO236AB
- DIODE ZENER 27V 400MW SOD323
- SINGLE ZENER DIODES IN A SOD123
- IC TXRX NON-INVERT 3.6V 20SSOP
- IC BUFFER NON-INVERT 6V 16TSSOP
- DIODE ZENER 16V 500MW ALF2
- TRANS NPN 40V 100MA TO236AB
- DIODE SCHOTTKY 60V 3A CFP15
- TRANS PNP 45V 500MA SOT323
- TRANS NPN 20V 30MA TO236AB
- IC MUX/DEMUX DUAL 4X1 16SOIC
- IC MULTIPLEXER 4 X 2:1 16TSSOP
- IC FF D-TYPE SNGL 8BIT 20SO
- TRANS PNP 80V 4A SOT89
- IC DECODER/DEMUX 1X1:2 6XSON
- DIODE ZENER 7.5V 250MW TO236AB
- IC CONFIG MULT-FUNC GATE 6XSON
